Three Dimensional Integrated Circuits (3D IC)

Ferromagnetic Through Silicon Vias (FTSVs) in 3D ICs enable AC power distribution instead of DC. Enhance heat management and facilitate intra-IC communication. Vias and interconnects in the technology domain of 3D integrated circuits (3D ICs) are getting significant direction in IC research. However, power distribution, heat management, and intra-IC communication issues in state-of-the-art interconnects severely limit their development and integration in 3D ICs. PI, using its IP Foundry, equipped with deep tech expertise and cutting-edge research, invented Ferromagnetic Through Silicon Vias (FTSVs).

This invention utilizes the unique magnetic properties of ferromagnetic materials to enhance communication and thermal conductivity through ferromagnetic through silicon vias.